The wafer book cutters cut the wafer books with desired sizes.

 

TECHNICAL DETAILS:

-fully automatic operation, up to 15 cuts/min

-Cutting height: 60 mm

-It cuts full scantling vessel, manually or automatically, in blocks or single cutting.

-It cut wafers creamed or without creamed.

-Can work mechanically.

-the surfaces contacted with the product will be stainless steel.

-Cutting process is wire system, can be manufactured by knife if this is wanted.

-Double positions cutting

-Block rotating system before cutting.

-cutting of individual books possible

-product sizes variable by exchangeable cutting frames with cutting wires or blades 

 

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