The wafer book cutters cut the wafer books with desired sizes.
-fully automatic operation, up to 15 cuts/min
-Cutting height: 60 mm
-It cuts full scantling vessel, manually or automatically, in blocks or single cutting.
-It cut wafers creamed or without creamed.
-Can work mechanically.
-the surfaces contacted with the product will be stainless steel.
-Cutting process is wire system, can be manufactured by knife if this is wanted.
-Double positions cutting
-Block rotating system before cutting.
-cutting of individual books possible
-product sizes variable by exchangeable cutting frames with cutting wires or blades